| Category | Specifications |
|---|---|
| Core Architecture | Arm® Cortex®-M7 core with double-precision FPU and DSP instruction set, 480 MHz clock speed |
| Memory | – 128 KB SRAM + 1 MB Flash – Supports XIP (Execute-In-Place) for direct execution from external Flash |
| Cache | 16 KB I-Cache + 16 KB D-Cache, with Art Accelerator™ for instruction execution acceleration |
| Peripheral Interfaces | – USB 2.0 OTG (HS/FS), CAN FD – Ethernet MAC, SDMMC – Multiple SPI/I2C/UART interfaces |
| Analog Features | – 16-bit ADC (3 MSPS) – 12-bit DAC |
| Package & Pins | TFBGA-144 package, supports high-density PCB design |
| Operating Conditions | Industrial temperature range (-40°C to +85°C), wide voltage supply (1.7V~3.6V) |
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Maxi International (HK) Co., Limited
