Waldom Electronics Highlights Industry Opportunity in New Article on UN Global Compact

Waldom Electronics has published a new article, “What is the UN Global Compact – and is the Electronic Components Industry Ready to Step Up?”, calling attention to the importance of corporate sustainability in the electronic components sector and encouraging greater industry participation in the United Nations Global Compact. The UN Global Compact, founded in 2000, […]

Event-based vision sensor powers wearable eye tracker

Prophesee recently announced that its event-based vision technology is designed into the new aSee glasses-EVS wearable eye tracker from 7invensun. Aimed at scientific, medical, and industrial use cases, the design features Prophesee’s GenX320 sensor that enables an eye movement sampling rate of up to 1,000 Hz. The 7invensun wearable eye tracker features a glasses-like design […]

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Smartwatch bands linked to toxic PFAS risks

Key Things to Know: New research from the University of Notre Dame found high levels of PFHxA, a PFAS “forever chemical,” in popular smartwatch wristbands. PFAS compounds are extremely persistent in the environment and have been linked to hormone disruption, infertility, liver toxicity, and certain cancers. Absorption through the skin is not yet fully understood, […]

Samtec Releases 800-Position High-Performance Array Connectors  

Samtec is excited to introduce the newest members of its AcceleRate HP® high-performance array family: 800-position APM6, APF6 at a 5 mm stack height.   The AcceleRate HP® connector set delivers exceptional signal integrity performance and density […] Read the original post at Samtec Releases 800-Position High-Performance Array Connectors  

ECIA’s GIPC Welcomes New Committee Member

Adam Badgett Director, Renesas Electronics, joins the team ECIA is pleased to announce that Adam Badgett, Director, Customer Service at Renesas has agreed to serve on ECIA’s Global Industry Practices Committee (GIPC). Adam has been in the Semiconductor industry for 30+ years with experience in Supply Chain, Manufacturing, Engineering, and Operations. He was Vice President […]

Marvell unveils 64 Gbit/s D2D interface IP

Marvell Technology, Inc. has claimed the industry’s first 2-nm 64 Gbits/s bi-directional die-to-die (D2D) interconnect, offering higher bandwidth and efficiency together with advanced power management for AI infrastructure. This will enable chip designers to boost the bandwidth and performance of next-generation XPUs (AI accelerators) while reducing power and silicon area. The interface IP, delivering 32 Gbits/s […]

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China Semiconductor Industry Pushes With 3C6000 Chips

Key Things to Know: Western export controls backfired, accelerating China’s domestic semiconductor innovation and investment. Loongson’s 3C6000 CPUs showcase ISA independence with up to 64 cores, competitive performance, and national security certification. China’s self-reliant chip strategy is reshaping global supply chains and challenging Western tech dominance. Engineers and policymakers face new dilemmas balancing cost, security, […]

TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

TDK Corporation expanded its PLEC69B series (1.2 x 0.6 x 0.95 mm – L x W x H) of thin-film inductors, used for separating the data signal from the power […] Read the original post at TDK Releases Low Loss Thin-Film Inductors for AI Data Centers The post TDK Releases Low Loss Thin-Film Inductors for […]