Sony develops RGB-IR image sensor for in-cabin monitoring

Extending its portfolio of image sensors for automotive applications, Sony Semiconductor Solutions Corp. has announced the upcoming release of its new 5-megapixel (MP) IMX775 CMOS RGB-IR image sensor with the industry’s smallest pixel size of 2.1 µm. Delivering high quality RGB (visible light) and near-infrared (NIR) imaging on a single chip, the IMX775 targets in-cabin monitoring cameras.

The new image sensor leverages Sony’s proprietary pixel structure to achieve both the industry’s smallest pixel size and the highest NIR sensitivity at the 940-nm wavelength at the same time. This pyramid array structure inside the pixels enhance the quantum efficiency even with the miniaturized pixel size. The small pixels enable a 5-MP resolution and a wide angle of view for single-chip monitoring of vehicle interiors including the driver and passengers.

Sony's IMX775 RGB-IR bare chip (left) and packaged product (right).

IMX775 RGB-IR bare chip (left) and packaged product (right) (Source: Sony Semiconductor Solutions Corp.)

The combination of the RGB and IR imaging delivers improved driver safety by enhancing the precision of in-cabin monitoring. The RGB-IR image sensor can capture wide-angle images of the interior of the vehicle including the driver and passengers. Claiming the industry’s highest NIR sensitivity with 35% quantum efficiency (QE) for a wavelength of 940 nm and the highest dynamic range of 110 dB for RGB imaging, the image sensor features a new signal processing algorithm that is used to remove NIR elements from the RGB pixels for on-chip processing, resulting in high color reproduction.

A high level of QE in NIR contributes to high-precision recognition of the driver’s line of sight and passenger status even in low-light conditions, regardless of the time of day, Sony said.

Sony IMX775 image comparison showing image without NIR component removal algorithm (left) and with NIR component removal algorithm (right).

IMX775 image comparison: Without NIR component removal algorithm (left) and with NIR component removal algorithm (right) (Source: Sony Semiconductor Solutions Corp.)

The RGB-IR sensor uses a hybrid exposure system to achieve RGB/NIR high image quality on a single chip. For RGB imaging, a rolling shutter is combined with on-chip image processing to achieve the high dynamic range, which results in high quality RGB images even inside vehicles with significant differences in brightness. In NIR imaging, the global shutter exposure and high NIR sensitivity enables high-precision recognition of movements such as driver line of sight and blinking.

Mass production of the IMX775 is planned for Spring 2026. The IMX775 will be available in a bare chip or 120-pin BGA package. Sony plans to obtain automotive AEC-Q100 Grade 2 certification for the IMX775 by the time mass production begins. The development process complies with ISO 26262 for automobile safety and is in compliance with the automotive safety standard ASIL-B.

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