OKI Circuit Technology (OTC) has launched rigid-flex printed circuit boards (PCBs) with embedded copper “coins” that offer improved heat dissipation for rockets and satellite-mounted equipment operating in vacuum environments. Targeting New Space applications, the PCBs address heat management for components mounted on the PCBs, while enabling space- and weight-savings.

These rigid-flex PCBs combine a thin, light, soft, and durable flexible circuit board (flexible printed circuit) made from insulating film, with a high-strength rigid PCB. This design allows bending for installation in tight spaces inside equipment. Thanks to their connector-less feature, no connectors are needed to link the boards, while also enabling reductions in space, weight, and mounting work-hours, the company said.

(Source: OKI Circuit Technology)

The higher performance of components mounted on the PCBs generates more heat, OTC said, resulting in the need for improved heat dissipation in vacuum environments like space, where no convective heat dissipation occurs.

OTC’s rigid PCBs with its proprietary PCB technology using copper coins (copper inlay) resolve this issue, the company said. The cylindrical-shaped copper coins with high thermal conductivity are inserted into PCB through-holes, and bonded to heat-generating components to dissipate heat to the underside of the PCB.

The rigid-flex PCBs are available starting in August 2025 for development, prototyping, and mass production. OTC can accommodate the small-lot production of PCBs to meet different specification requirements according to the shape, size, and mounting location. OTC has achieved certification for all seven schedules of the Japan Aerospace Exploration Agency (JAXA) PCB standards.

OTC will showcase the rigid-flex PCBs at the Small Satellite Conference, August 10-13, 2025, at the Salt Palace Convention Center, Salt lake City, Utah. The company will exhibit at the Japan Booth.

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