Morse Micro announces Wi-Fi HaLow product availability

Morse Micro's MM8108 Wi-Fi HaLow SoC.

Morse Micro recently announced the mass production and general availability of its second-generation Wi-Fi HaLow MM8108 system-on-chip (SoC), including modules and evaluation kits. The company also unveiled its next-generation evaluation platform, HaLowLink 2.

Morse Micro's MM8108 Wi-Fi HaLow SoC.

(Source: Morse Micro)

The MM8108 Wi-Fi HaLow SoC is now in full-scale production. It provides long-range Wi-Fi at speeds up to 43 Mbits/s, targeting long-range, low-power IoT devices.

Complementing the SoC is a series of evaluation kits including the MM8108-EKH01, MM8108-EKH05, and MM8108-EKH19. The MM8108-EKH01 features the MM8108 SoC with Broadcom’s BCM2711 SoC on a Linux-based Raspberry Pi 4 platform. The MM8108-EKH05 provides the MM8108 SoC with ST Microelectronics’s STM32U585 on a FreeRTOS-based IoT platform. The MM8108-EKH19 integrates the MM8108 SoC on a USB-A dongle with GLi.net’s GL-MT3000 router with MediaTek’s MT7981B Wi-Fi 6 SoC. These kits are available through global distributor Mouser Electronics.

Module availability of the MM8108 is also expanding with Morse Micro’s MM8108-MF15457 reference module now offering general availability on Mouser.com. In addition, AzureWave’s AW-HM677 module is available for high volume directly from AzureWave, and Vantron’s VT-MOB-AH-8108 module is available to support low- to mid-volume customer requirements, with full mass production scheduled for later this year. Quectel’s modules are also scheduled for mass production later this year.

Building on its HaLowLink 1 platform, Morse Micro announced its next-generation evaluation platform, HaLowLink 2. The platform upgrades the core Wi-Fi HaLow SoC from the MM6108 to the MM8108, delivering 43 Mbits/s throughput at an extended range thanks to a 256-QAM modulation rate and 26-dBm internal power amplifier on the MM8108. General availability is scheduled in the first quarter of 2026. It will be available in the U.S., EU, UK, Canada, Japan, and Australia. The HaLowLink 2 reference design simplifies evaluation, prototyping, and deployment of Wi-Fi HaLow networks.

Morse Micro also announced, separately, a new technology partnership with Browan Communications to drive the adoption of Wi-Fi HaLow worldwide. Browan will develop a next-generation access point powered by Morse Micro’s MM8108 chip, supporting AI at the edge and intelligent IoT 2.0 applications.

The post Morse Micro announces Wi-Fi HaLow product availability appeared first on Electronic Products.

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