High-bandwidth memory (HBM) is an important part of AI processors, handling massive data processing and computations. In response, Teradyne, Inc. has launched the Magnum 7H, a next-generation memory tester for testing HBM devices, integrated with GPUs and accelerators in high-performance, generative AI servers.

The Magnum 7H delivers high-parallelism, high-speed, and high-accuracy testing for HBM stacked die at scale, Teradyne said.

(Source: Teradyne, Inc.)

The memory tester supports a variety of HBM versions, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E, providing test coverage from base-die wafer test to memory core test and burn-in. It also supports testing of pre-singulated HBM devices at the known-good-stack-die (KGSD) or chip-on-wafer level with traditional probers and probe cards, and post-singulated HBM with new bare-die probers/handlers for improved device quality.

The tester also features a fast DPS response time for higher device yield, as well as comprehensive memory and logic testing of HBM stacks containing both logic base dies and DRAM dies.

The high-speed memory testing is delivered with a flexible algorithmic pattern generator and logic testing with a logic vector memory option. Fail list streaming ensures high-speed error capture for both memory and logic testing, the company said.

The tester delivers high-speed testing of current HBM3/3E and next-generation HBM4/4E devices up to 4.5 Gbits/s and provides high parallelism necessary to lower overall HBM cost-of-test. Delivering high parallelism, it is configurable for up to 9,216 digital pins and 2,560 power pins for high touchdown efficiency at probe, delivering a 1.6× increased throughput in mass production environments.

Volume shipments and HBM device production on Teradyne’s Magnum 7H have started ramping at the largest HBM manufacturers.

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