Technical Article: Polymer Solid Electrolytic Capacitors for Automotive Applications
Polymer Solid Electrolytic Capacitors for Automotive ApplicationsWritten By: Jaroslav Tomasko | Slavomir Pala Abstract: Tantalum electrolytic capacitors are constructed using a sintered pellet of powdered tantalum as the anode of the device. A grown oxide layer on the contoured surface of the pellet acts as the dielectric insulator, and a cathode terminal is formed using […]
Current sense resistor extends power rating
Targeting higher-current applications, Bourns, Inc. has expanded its CRK series with the launch of its Model CRK1225 current sense resistor. The new device provides up to 3 W of power dissipation and supports a wider resistance range in a small 1225 package. (Source: Bourns, Inc.) This AEC-Q200-compliant, automotive-grade series uses metal strip technology in a wide terminal […]
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Bourns Releases New 150C Shielded Power Inductors
Bourns introduces new SRP4020T series shielded power inductors for enhanced EMI reduction. Bourns Magnetics Product Line announces the launch of the new SRP4020T Series Shielded Power Inductors, designed to offer […] Read the original post at Bourns Releases New 150C Shielded Power Inductors
Investing in efficiency, sustainability and customer value
Discover how Incap UK’s €1.5M investment in automation and sustainability delivers faster lead times, higher capacity and smarter electronics manufacturing. ECS will see Incap UK highlight its latest investments and ongoing commitment to advanced electronics manufacturing. As part of a €1.5M upgrade, the company has enhanced its SMT production line, including the UK’s first automated […]
Stacked Ceramic Capacitors for Defense Applications
MIL-PRF-32535 for discrete MLCCs has led to the discussion of stacked ceramic capacitors based on BME technology. Stacked ceramic capacitors are multiple discrete multi-layer ceramic capacitors (MLCCs) terminated onto a common lead-frame for through-hole or SMT operations. They capture many of the inherent benefits of MLCC technology, like a low-loss material set, low ESR (equivalent […]
O-RAN baseband board delivers full-band 5G/4G flexibility
RANsemi has launched the RNS805-RU-BB, a fully integrated baseband board targeting the development of 5G/4G Open RAN radio units (O-RUs) for manufacturers and system integrators developing next-generation O-RUs for complex multi-band, multi-operator deployments. (Source: RANsemi) The 165 × 170-mm plug-and-play baseband board combines RANsemi’s RNS805 O-RU SoC with Texas Instruments’ AFE7769D 4T4R multi-band analog front-end (AFE) radio frequency […]
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The Connector Industry is Undergoing Transformation
Connector industry is changing landscape according to the article by Ron Bishop published by TTI Market Eye. The connector industry has experienced significant shifts in recent years, driven primarily by […] Read the original post at The Connector Industry is Undergoing Transformation
Supporting growing Asian customer base
Danisense has opened a sales office in Shanghai, China to be closer to the Asian market and support its growing Asian customer base locally. The office is headed by GM Siyu Yan, who has over 15 years’ experience in the electronics and test/measurement sector. Danisense’s CEO, Henrik Elbæk, said: “As CEO of Danisense, I am […]