SAW filters made simple: A quick front-end primer
Surface acoustic wave (SAW) filters may sound exotic, but they are everyday workhorses in wireless front-ends. Compact, cost-effective, and reliable, they shape signals with precision while keeping designs simple. This quick primer walks through the basics—what they do, why they matter, and how they fit into modern communication systems. SAW filter fundamentals SAW filters exploit […]
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Würth Elektronik data now live in Accuris
Würth Elektronik is providing live, manufacturer‑verified data for more than 22,000 electronic and electromechanical components to the Accuris Parts Intelligence and BOM Intelligence platforms. This integration gives design engineers and purchasing teams direct access to current technical and supply‑chain information for Würth Elektronik parts inside their existing component and BOM tools. Why this matters for […]
Navitas tightens SiC losses with refined TAP
Navitas Semiconductor has announced its 5th-generation GeneSiC platform featuring high-voltage trench-assisted planar (TAP) SiC MOSFETs, describing it as a significant advancement over previous generations. The new 1200-V MOSFET line complements Navitas’ ultra-high-voltage 2.3-kV and 3.3-kV devices based on its 4th-generation GeneSiC technology. The latest generation incorporates the company’s most compact TAP architecture to date, combining […]
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Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors
Vishay’s new CRCW0201-AT e3 series extends the company’s thick film chip resistor portfolio into the ultra-compact 0201 size with full AEC-Q200 qualification. The series targets space-constrained automotive, industrial, and telecom boards where designers need stable performance, robust environmental behavior, and automotive-grade qualification. Key features and benefits The Vishay CRCW0201-AT e3 thick film chip resistor series […]
Software accelerates 3D interconnect design
The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages. By removing time-consuming manual steps, the tool streamlines the optimization of complex interconnect structures—including vias, transmission lines, solder balls, and micro-bumps—while ensuring signal and power integrity in densely packed systems. Part of Keysight’s EDA portfolio, the software […]
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ECIA January 2026 Reports Strong Sales Confidence
ECIA’s January 2026 survey signals the strongest sales sentiment for the electronic components industry in more than four and a half years. The January 2026 results show broad-based confidence across product categories, end-markets, and all major supply chain channels as the industry enters the 2026. Overall Sales Sentiment at Multi‑Year High The overall average index […]
Samsung leads with HBM4 DRAM performance
Samsung has begun mass production and commercial shipments of its HBM4 DRAM, marking what it describes as an industry first. Built on Samsung’s 6th-generation 10-nm-class DRAM process with a 4-nm logic base die, this high-bandwidth memory is optimized for performance, reliability, and energy efficiency in AI, HPC, and datacenter applications. Samsung’s HBM4 delivers a consistent […]