Navitas Semiconductor has announced its 5th-generation GeneSiC platform featuring high-voltage trench-assisted planar (TAP) SiC MOSFETs, describing it as a significant advancement over previous generations. The new 1200-V MOSFET line complements Navitas’ ultra-high-voltage 2.3-kV and 3.3-kV devices based on its 4th-generation GeneSiC technology.
The latest generation incorporates the company’s most compact TAP architecture to date, combining planar-gate ruggedness with trench-enabled performance gains to improve efficiency and long-term reliability. It targets high-voltage applications including AI data centers, grid and energy infrastructure, and industrial electrification.
Compared with the prior 1200-V devices, the new generation delivers a 35% improvement in RDS(on) × QGD figure of merit, reducing switching losses and enabling cooler, higher-frequency operation. About a 25% improvement in QGD/QGS ratio, together with a stable high threshold voltage (VGS,TH ≥ 3 V), strengthens switching robustness and improves immunity to parasitic turn-on in high-noise environments.
Navitas expects to introduce products based on its 5th-generation technology in the coming months. For additional information, contact a Navitas representative or email info@navitassemi.com.
Navitas Semiconductor
The post Navitas tightens SiC losses with refined TAP appeared first on EDN.