Additive solder mask process revolutionises PCB manufacturing

Step onto STARTEAM GLOBAL’s stand to discover how inkjet solder mask is revolutionizing PCB production by reducing waste, increasing speed and delivering unmatched precision.

With its new Flero STARTEAM (FST) factory in Italy, STARTEAM GLOBAL is setting new standards in the evolving world of printed circuit board (PCB) manufacturing. The heart of this innovation is the additive solder mask process, specifically digital inkjet solder mask printing—a technology that redefines efficiency, sustainability and quality in PCB production.

Unlike traditional solder mask methods, which coat the entire board and rely on photomasks to develop patterns, digital inkjet printing applies the mask precisely where it’s needed. This additive approach slashes waste, cuts production steps and speeds up turnaround times.

Traditional processes can take multiple stages—pre-treatment, coating, drying, exposure, development and curing—while inkjet printing streamlines this to pre-treatment, printing and curing. The result? A much higher resolution, comparable to conventional photo-imageable masks, with the added perks of flexibility and eco-friendliness.

Faster production means quicker delivery of high-quality PCBs. The precision of inkjet technology ensures flawless coverage, reducing defects and enhancing reliability. Design changes? No problem. Digital printing adapts without the costly, time-consuming photomask adjustments required in traditional methods. Plus, with less material waste and energy use, it aligns with sustainability goals.

The process supports varying resist thicknesses and delivers crack-free performance even after multiple reflow cycles. While the initial investment in inkjet systems is notable, long-term savings from reduced waste and faster workflows make it a smart choice for both manufacturer and customer.

www.starteam.global

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