Magnachip Semiconductor Corp. has introduced a new 80-V MXT MV MOSFET, the MDLT080N017RH, in a TO-leaded top-side-cooling (TOLT) package. The new device offers improvements in thermal management and power efficiency for motor control systems in e-scooters and light electric vehicles (LEVs).

Unlike conventional TO-leadless (TOLL) packages that dissipate heat through the bottom, the TOLT package releases heat directly from the top via a mounted metal heat sink, substantially reducing thermal resistance between the junction and the external environment, Magnachip said. This makes it well-suited for thermally demanding applications, such as e-scooters and LEVs.

Based on simulations and tests conducted by Magnachip, the 80-V MV TOLT package solution achieved an average 22% reduction in junction temperature compared to using standard TOLL packages, which will extend the application lifespan and enhance system reliability. The R_DS(on) is 1.7 mΩ (max., VGS=10V).

(Source: Magnachip Semiconductor Corp.)

“The TOLT package enables compact, lightweight application designs thanks to its high power density and efficient thermal flow that does not compromise current-handling capability and thermal safety margins,” Magnachip said.

Other applications include e-bikes, personal mobility devices, high-efficiency DC motor drives, battery management systems, and power distribution systems.

Magnachip offers a range of 80-V MXT MOSFETs in a variety of packages. Datasheets, including for the new MDLT080N017RH, are available here.

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