Power semiconductor suppliers are racing to meet differentiated demand for their components and systems as electronics in various forms and sizes penetrate all segments of the economy, creating both opportunities and challenges.

Power supply and its management have never been an afterthought in the electronics product design cycle. They are just too important to the effective operation of the electronics device to be relegated to a secondary concern. Still, power has not always been a primary focus early in the cycle, hovering somewhere between what design engineers consider a necessary operation and a niggling part of the process. This is rapidly changing, however. Today, power supply and the power management system (PMS) have become critical and early considerations for developers, according to electronic industry executives. They note that energy generation and management have become very central to the design process, driven by considerations such as product size and other form factors, performance, design and manufacturing efficiencies, cost, end-of-life and environmental impact management activities as well as the introduction of new materials and power sources.

The advent of artificial intelligence has further deepened concerns about efficient power management, leading to stronger demand in the segment, noted Jochen Hanebeck, CEO of Infineon Technologies AG. “The move towards increased use of artificial intelligence, is driving demand for our leading power supply solutions for AI data centers,” Hanebeck said, earlier this year while presenting the company’s first quarter financial results. “This is a prime example of our long-term growth drivers, digitalization and decarbonization.” Precedence Research analysts forecast demand for power semiconductors will continue to climb through the next decade. “The global power semiconductor market size was $50.30 billion in 2023, calculated at $52.57 billion in 2024 and is expected to reach around $81.70 billion by 2034, expanding at a CAGR of 4.50% from 2024 to 2034,” they said, in a report. “The rising demand for home appliances across the world is driving the growth of the power semiconductor market.”

The growing importance attached to power management by OEMs and semiconductor companies has led to advancements in both technology applications as well as the materials used over the last several decades. Many of these innovations were on display at industry events this year, including at the annual IEEE Applied Power Electronics Conference and Exposition, (APEC), a leading event in North America for power electronics professionals held in Atlanta. The event focused on practical and applied aspects of the power electronics industry and highlighted the latest innovations, research, and products in power electronics.

At APEC 2025, industry executives emphasized the importance of power management, AI-driven energy solutions, and sustainability. The discussions focused on next-generation semiconductor technologies, efficiency improvements, the role of AI in optimizing power systems, automotive, medical, industrial power applications, highlighting advancements in efficiency, sustainability, and next-generation semiconductor technologies. Peter Friedrichs, Fellow of Silicon Carbide at Infineon Technologies, shared insights on the future of SiC power devices and their role in energy efficiency and electrification. He emphasized that SiC technology is transforming power electronics, enabling higher efficiency, reliability, and compact designs across industries. “Silicon carbide is revolutionizing power electronics, enabling higher efficiency and reliability in applications ranging from electric vehicles to industrial automation,” Friedrichs said. “The next generation of CoolSiC technology will push the boundaries of power density and system performance, making energy conversion more sustainable. Infineon is committed to driving innovation in wide-bandgap semiconductors, ensuring that SiC solutions meet the growing demands of AI-driven data centers and renewable energy applications.”

Friedrichs had two live demonstrations of Infineon’s latest SiC products, highlighting their impact on AI hyperscalers, telecom infrastructure, and electric mobility. Meanwhile, John Kassakian, Professor Emeritus at MIT, delivered a presentation titled: A Technology’s Journey: 40 Years of APEC. His talk provided a retrospective analysis of four decades of advancements in power electronics, highlighting key milestones in semiconductor devices, control strategies, packaging technologies, and sensor integration. He traced the development of anti-lock braking systems, motor drive control, solar and wind energy harvesting, and medical imaging innovations such as MRI. Kassakian emphasized how wide-bandgap materials like SiC and GaN have transformed power efficiency and compact system designs.

Evolution of power electronics Innovations in power control systems were showcased at APEC 2025, particularly for semiconductor fabrication and industrial applications. Infineon ‘s Kassakian discussed emerging technologies that will shape power electronics over the next decade, including AI-driven energy solutions and nextgeneration power conversion methods. “Power electronics has evolved from a niche technology into a fundamental enabler of modern infrastructure, shaping industries from automotive to renewable energy,” Kassakian noted. Companies introduced next-generation power devices for electric vehicles, industrial automation, and robotics. APEC 2025 featured key discussions on power management systems, with industry leaders highlighting efficiency, AI-driven optimization, and sustainability. Experts emphasized AI’s role in predictive maintenance and real-time power optimization. Presenters also discussed carbon-free energy, hydrogen standardization, and grid stability. Innovations in GaN and SiC technologies were displayed, improving power density and reliability. “We are bringing unique digital power solutions to the market that solve the entire power ecosystem challenge,” said Thar Casey, CEO of Amber Semiconductor

Infineon’s presentation at APEC 2025 focused on power management solutions for AI-driven applications, data centers, and energy storage. The company displayed its latest advancements in CoolGaN and CoolSiC technologies, which enable higher power density, improved efficiency, and reduced environmental impact. For data center innovations, the company introduced an 8kW power supply designed for servers and data center applications, improving energy efficiency and performance. Infineon explored rack architecture evolution to meet AI server demands and vertical power delivery for AI products. Infineon demonstrated how its power solutions enhance robotics and energy storage systems, supporting decarbonization and digitalization.

Companies like Onsemi displayed SiC MOSFETs and GaN power devices designed to improve electric vehicle (EV) efficiency and range. Presenters at APEC discussed high-power DC fast-charging stations, emphasizing reduced charging times and improved thermal management. AI integration in battery management and power distribution was a key focus, optimizing energy consumption in EVs. Innovations in ultra-low noise power supplies for MRI machines, CT scanners, and surgical equipment were highlighted. “By streamlining loss simulations, we empower designers to create more energy-efficient solutions for automotive and industrial markets,” said Didier Balocco, an engineer at Onsemi. In the medical area, wireless charging solutions for pacemakers and neurostimulators are being introduced to improve patient mobility and device longevity. “AI-driven power management is ensuring reliable energy delivery for critical medical applications, from MRI machines to implantable devices,” said Pei-Hsin Liu, a system engineer at Texas Instruments, specializing in power electronics, digital control, and semiconductor technologies.