Microchip Technology Inc. has introduced a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology. These devices are available in six variants at 1,200 V and 1,700 V with high-current ranging from 300 A to 900A. The new DP3 power modules are designed to provide higher power density and simplify system design in a range of motor drive, data center, and sustainability applications.
(Source: Microchip Technology Inc.)
These IGBT7 power modules reduce power losses by up to 15–20% compared to IGBT4 devices and operate reliably at higher temperatures up to 175°C during overload. They also enhance protection and control during high-voltage switching, making them suitable for maximizing power density, reliability, and ease of use in industrial drives, renewables, traction, energy storage, and agricultural vehicles, Microchip said.
Available in a phase-leg configuration, the DP3 power modules, measuring 152 × 62 × 20 mm, enable a frame size jump for increased power output. This advanced power packaging eliminates the need for paralleling multiple modules and helps reduce system complexity and bill-of-materials costs, according to Microchip. The DP3 power modules are also a second-source option for industry-standard EconoDUAL.
The DualPack 3 power modules are now available in production quantities. They can be purchased directly from Microchip or through an authorized distributor or sales representative.
The post Microchip launches IGBT7 power modules appeared first on Electronic Products.
