Connected by design: where relationships meet innovation

Join over 700 industry professionals at the Hilton Austin for three days of collaboration, education and networking, where strong relationships meet smart innovation in electronics sales.

The 2026 ERA Conference takes place in Austin, Texas, on 22 to 24 February 2026, bringing together electronics components sales reps, distributors and manufacturers. The Hilton Austin is the new venue.

The conference brings together all segments of the industry in a collaborative and energetic environment, offering attendees a unique opportunity to learn, connect and grow.

The 2026 theme is ‘Connected by Design: Where Relationships Meet Innovation’ and thus the keynote, general and breakout sessions will focus and reflect on the power of face-to-face conversations, strong team collaboration and smart use of technology to engage and inform.

The general schedule for the event is as follows:

Sunday 22 Feb: Attendee badge pick-up, welcome cocktail reception.

Monday 23 Feb: Breakfast workshops, keynote speaker session, two general sessions, various breakout sessions and the Conference networking party.

Tuesday 24 Feb: Breakfast workshops, two general sessions, various breakout sessions and close of Conference at 5:30 pm.

Educational sessions will cover timely and pertinent topics such as AI in sales, leadership, legal issues facing the rep world, an economic and market update, and more. It is sure to be a dynamic and interactive program full of useful tools and takeaways and inspiring messages.

The new venue, the Hilton Austin in downtown Austin, is a modern and spacious setting that will enable ERA to host more Conference attendees on-site, allowing for more connection and collaboration.

The Conference is estimated to have more than 100 sponsor companies and will host more than 700 attendees. Several ERA Recognized Resource exhibitors will also be located in the exhibit hall to demonstrate how they can improve efficiency and bottom line for reps, manufacturers and distributors.

www.era.org/era-conference

First AI Chip That Learns and Infers

The AI Hardware Problem One of the most significant barriers to progress in artificial intelligence…

Enabling modular connectivity for alternative energy sources

By combining power, data, fibre and compressed air in a modular connector interface, Harting is…

The transition from 54-V to 800-V power in AI data centers

While compute devices such as CPUs, GPUs, and XPUs are stealing the limelight in the…

Access to this page has been denied.

Access to this page has been denied either because we believe you are using…