RISC-V Acceleration for Deep Learning at the Edge
Key Things to Know: AI workloads are outpacing traditional hardware, exposing the limitations of CPUs and even GPUs in handling deep learning at scale. Researchers at University College Dublin have demonstrated a bare-metal RISC-V System-on-Chip (SoC) with the open-source NVIDIA Deep Learning Accelerator (NVDLA), removing the need for a full operating system. This approach achieves […]
Different Causes of Capacitor Degradation and Failure Mechanisms
The paper “Capacitor Degradation and Failure Mechanisms: Exploring Different Causes Across Technologies” was presented by Frank Puhane, Würth Elektronik eiSos GmbH & Co.KG, Waldenburg, Germany at the 5th PCNS Passive Components Networking Symposium […] Read the original post at Different Causes of Capacitor Degradation and Failure Mechanisms
Rhopoint Celebrates 50 Years of Technical Excellence
Rhopoint Components Ltd. a specialist technical distributor of precision electronic components and sensors is proud to celebrate its 50th anniversary in September 2025. Since its founding in 1975, the company has established a reputation for design-led distribution, delivering engineering solutions that meet the most demanding requirements across aerospace, oil, gas, EV, automotive, medical, energy and […]
MediaTek Dimensity 9500 chipset upgrades CPU performance
MediaTek has launched the Dimensity 9500 chipset, its most advanced mobile platform with on-device AI, boasting big improvements in performance, power efficiency, and power consumption. Targeting flagship 5G smartphones, the chipset leverages a third-generation All-Big-Core CPU design for greater performance, a new cache and memory architecture, and a new compute-in-memory-based (CIM) neural processing unit (NPU). […]
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High-Frequency Ceramic Capacitor Performance of Novel Embedded Electrode Design
The paper “High-Frequency Capacitor Performance of Novel Embedded Electrode Design” was presented by Mark Simpson, Quantic Eulex, Monterey Park, CA, USA, at the 5th PCNS Passive Components Networking Symposium 9-12th September 2025, Seville, Spain as paper No. 3.4. This […] Read the original post at High-Frequency Ceramic Capacitor Performance of Novel Embedded Electrode Design
Master Bond offers nanosilica-filled, dual-core adhesive
Master Bond LED422DC90 is a one component, nanosilica filled dual cure adhesive system engineered for high-speed fixturing and bonding of opaque substrates. This unique “side-bonding” capability allows for rapid polymerization up to 3-4 mm in depth by exposing the adhesive to 405 nm LED light from an angle. The cure is then completed by a […]
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SiTime Titan Q&A on Timing Innovation
Key Things to Know: MEMS overtakes quartz: The SiTime Titan Platform™ completes the shift from quartz to MEMS in oscillators, clocks, and resonators. Integration advantage: Titan moves resonators into SoC packages, cutting design delays and simplifying system architecture. Smaller & more efficient: At 0.46 x 0.46 mm, Titan enables lower power use, faster startup, and […]