Murata Integrates Component Models into Cadence EDA Tools
Murata Manufacturing Co., Ltd. announces a significant collaboration with Cadence Design Systems, Inc., making product libraries directly accessible within Cadence’s leading Electronic Design Automation (EDA) tools. Murata’s selected inductor and […] Read the original post at Murata Integrates Component Models into Cadence EDA Tools
Infineon launches industry’s first radiation hardened buck controller with integrated gate drive
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the industry’s first radiation-hardened (rad-hard) buck controller with an integrated gate drive. Designed for Point of Load (PoL) power rails in commercial space systems and other extreme environments, the new device is particularly well-suited for distributed satellite power systems and digital processing payloads, including FPGA […]
Increasing ADC resolution by adding dither to DC signals
An EDN Design Idea (DI) presented a discussion of how to increase the resolution of an ADC by adding a non-deterministic, zero-mean, Gaussian noise dither waveform to a signal to be converted; then, oversampling the sums, and low-pass filtering (thereby averaging) the ADC conversions. (As noted, a filter that optimally removes out-of-band high-frequency dither noise is generally […]
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Pressure Sensor Design for Artificial Lift Systems
By David Beatson, Joint Managing Director, Rhopoint Components. Originally published on rhopointcomponents.com on 16 October 2024. Key Things to Know: Artificial lift environments (LPHT, abrasive media, vibration) demand application-specific pressure sensors to maintain reliable measurement. Robust design begins with precise operating definitions: working, proof and burst pressures, plus allowances for shock, spikes and thermal cycling. Engineering choices—reinforced […]
Molex Acquires Smiths Interconnect
Molex announces agreement to acquire Smiths Interconnect, enhancing its position in aerospace and Defense. Molex, a leading global electronics connectivity innovator, announced that it has signed an agreement to acquire Smiths […] Read the original post at Molex Acquires Smiths Interconnect
Vishay Intertechnology SMD Inrush Current Limiting PTC Thermistors Increase Board-Level Efficiency to Lower Costs
Devices Combine Energy Handling to 340 J With High Voltages to 1200 VDC in Compact Package to Reduce Component Counts and Save Space. Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of insulated, surface-mount inrush current limiting positive temperature coefficient (PTC) thermistors. Designed to increase board-level efficiency and lower costs in automotive and […]
Edge MCUs bolstered by AI design toolchain
Edge AI designs, starting to see a trickle-down effect from AI data centers, increasingly rely on toolchains to keep up with the breakneck speed of AI. So, to bolster the edge AI ecosystem, Infineon Technologies has expanded its edge AI toolchain with the DEEPCRAFT Suite, a set of software, tools, and solutions that help engineers […]
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Applications processor targets in-cabin sensing
NXP Semiconductors unveils its i.MX 952 AI-enabled applications processor for automotive human-machine interfaces (HMIs), in-cabin sensing, and vision applications. This new applications processor leverages NXP’s sensor fusion, powered by the eIQ neutron neural processing unit (NPU), for applications such as driver monitoring, child presence detection, and industrial HMI systems. (Source: NXP Semiconductors) The i.MX 952 […]