Samtec, Inc. has expanded its AcceleRate HP product line with the introduction of the 800-position APM6 and APF6 high-performance array connectors in a low-profile 5-mm stack height. They feature an open-pin-field-array design for maximum grounding and routing flexibility.
(Source: Samtec, Inc.)
The new AcceleRate HP connectors offer high signal integrity and density, supporting data rates up to 112-Gbits/s PAM4 on a 0.635-mm pitch. The 800-position configuration (8 rows × 100 positions) is housed in a 68.62 × 18.20-mm (2.701 × 0.717-inch) footprint. They target high-throughput applications such as high-performance computing, artificial intelligence, storage, and networking.
Key specifications for the new array connectors include a 5-ohm impedance, 2-A max current rating (one pin powered per row), and 150 VAC (212 VDC) max voltage rating. They also offer protocol compatibility with PCIe 6.0, CXL 3.2, and 100 GbE.
In addition, the APM6 and APF6 connectors leverage Samtec’s Solder Column Termination for enhanced structural integrity. This IPC-Class-3-compliant method, suited for dense, high-speed interconnects, offers superior solder joint reliability and excellent insertion loss and return loss performance, Samtec said.
The APM6 and APF6 products are available directly through Samtec or through authorized distributors. Samtec also offers an AcceleRate HP SI evaluation kit for testing AcceleRate HP connectors. A 10-mm stack-height version is planned for the second quarter of 2026
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